Expanding the scope of national core technology for memory semiconductors
Image sensor, additional designation of packaging technology
The government has strengthened the national core technology in the semiconductor field. The range of existing memory technologies has been expanded. The image sensor and system semiconductor packaging technology were additionally designated. Prevention of technology leakage to foreign countries such as China seems to be a preemptive measure.
On the 14th, the Ministry of Trade, Industry and Energy confirmed and announced a draft amendment to the notice on the designation of national core technology and enactment of guidelines for industrial technology protection after deliberation and resolution by the 30th Industrial Technology Protection Committee.
According to the amendment, all stack assembly and inspection technologies related to memory semiconductors such as DRAM and NAND flash were designated as national core technologies. Previously, only technologies below 30 nanometers were included as core technologies. 5G mobile communication (5G) was added to the LTE/LTE_adv baseband modem technology. In addition, a new designation, process, and device technology for image sensors with a pixel 1 micrometer (μm·0.001 mm) or less and advanced package assembly and inspection technology for system semiconductors were newly designated.
This time, the content that has been added and reinforced as a national core technology is the technology of Samsung Electronics and SK Hynix, which are the leading domestic semiconductor companies and the world’s first and second largest memory semiconductor companies. The two companies are called as strong in DRAM and NAND based on the stacking assembly technology.
Image sensor and system semiconductor packaging technology are the core technologies of Samsung Electronics. Samsung Electronics introduced the industry’s first 1μm pixel image sensor in 2015. In 2019, it also introduced the mobile image sensor’Isocell Slim GH1′ with a 0.7μm pixel size.
In addition, Samsung Electronics is strengthening its post-processing business with advanced packaging technologies such as Fan Out Wafer Level Package (FO-WLP), Fan Out Panel Level Package (FO-PLP), and Fan Out Package On Package (FO-PoP). Samsung Electronics’ goal is to achieve the top rank in system semiconductors with advanced packaging technology.
If the FO-WLP technology is used, expensive printed circuit boards (PCBs) are not required, and the number of processes is shortened, thereby reducing cost. Package thickness can also be reduced. FO-PLP is a technology developed by Samsung Electronics and Samsung Electro-Mechanics as a task force (TF). Unlike WLP, which uses a circular carrier, it is packaged using a square panel. This technology was applied to the application processor (AP) in the Galaxy Watch. FO-PoP is a technology that sequentially stacks packages that function differently on one package.
The government’s strengthening of national core technology seems to be to prevent technology leakage to China in advance. China is pursuing Korea with its semiconductor prowess. In order to advance the technology, they have been outspoken at taking out manpower. Through domestic manpower sites and headhunting companies, the condition of preferential treatment for those with experience of Samsung Electronics and SK Hynix was specified, while the recruitment of engineers was blatantly mentioned by specifically mentioning the core semiconductor process.
In addition to semiconductors, the government has designated 71 technologies in 12 fields, including automobiles, shipbuilding, biotechnology, and information and communication, as national core technologies. Two more from the previous 69. Technologies in the fields of semiconductors (8 → 10), shipbuilding (7 → 8), and biotechnology (3 → 4) were additionally designated. In the field of information and communication (9 → 7), some contents were excluded.
National core technology refers to a technology that is likely to have a significant adverse impact on national security and national economic development if it is leaked abroad. Organizations that possess and manage this technology should take measures to protect the technology. In addition, if you intend to export related technologies or acquire or merge companies owned by foreigners, you must obtain government permission. If it is judged that the national core technology holding and management agency refuses, interferes with, or evades the matters for protection measures, a fine of not more than 10 million won may be imposed.
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