Seok-hee Lee, President of SK Hynix, “You can stack more than 600 layers of NAND flash”

Input 2021.03.22 15:49



SK Hynix CEO Lee Seok-hee is giving a keynote speech at the International Reliability Symposium (IRPS) of the International Institute of Electrical and Electronics Engineers (IEEE). / Provided by SK Hynix

“In the future, DRAM will enter the process of less than 10 nanometers (nm, 1 nanometer is 1 billionth of a meter), and NAND flash will be able to stack over 600 layers.”

In a keynote speech at the International Reliability Symposium (IRPS) of the International Institute of Electrical and Electronics Engineers (IEEE) held online on the 22nd, Lee Seok-hee, president and CEO of SK Hynix, said, “We will increase the’technical value’ by improving the design structure and reliability as well as the materials of memory semiconductors. “It will be,” he said.

Recently, SK Group has been emphasizing ESG (environmental, social, governance) management, which is called’Financial Story’. On this day, President Lee announced that it is important to realize three values: technology, society, and the era to achieve the financial story.

President Lee’s mention of DRAM with a process of less than 10 nanometers applied to the technological value and ultra-high-layer NAND flash with more than 600 layers does not seem to be irrelevant to the recent semiconductor technology competition. Earlier, Micron in the US announced that it has developed the world’s first 10-nano 4th generation (1a) DRAM and 178-layer high-layered NAND flash.

In addition, Lee said that he will contribute to solving social problems such as energy and environment for social value. A typical example is the solid state drive (SSD), which consumes less power. By simply replacing the computer storage device with an SSD in a hard disk drive (HDD), carbon dioxide emissions can be reduced by 93%. “By 2030 replacing hard disk drives (HDDs) in all data centers around the world with low-power solid state drives (SSDs), we can reduce CO2 emissions by 41 million tons,” he said.

Regarding’era values’, he mentioned the role of artificial intelligence (AI). President Lee said, “In the future, all devices will be integrated based on AI technology and smart ICT technology will be used in everything around us.” The (storage) technology can be integrated in the same form as a gene (DNA) semiconductor.”

President Lee said, “It is necessary to cooperate with partners to realize the spirit of the times and pursue social values ​​based on technology.”

Meanwhile, IRPS is an academic event organized by IEEE, where engineers and scientists from various technology fields such as semiconductors participate to share research results. In January, President Lee won the Outstanding Leader Award at the’Consumer Technology Society (CTSoc)’, an organization under the IEEE.

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