[서울=뉴스프리존]Reporter Lee Dong-geun = It is predicted that Samsung Electronics will start mass production of Intel chipsets within the first quarter of this year at the Austin fab in the US. Intel announced in its 4Q earnings announcement on the 21st (U.S. local time) that it will manufacture its own semiconductor core components but also expand consignment production.
Meritz Securities analyst Kim Sun-woo said in a report on the 25th, “According to our channel check, the mass production of Samsung Electronics’ Intel chipsets will begin earlier than expected.” “We have been preparing for development and mass production, and mass production of 3-4k/mo will begin at the S2 fab in Austin, Texas in the first quarter.”
According to analyst Kim Sun-woo, the mass production of Samsung Electronics’ Intel foundry (consigned semiconductor production) begins with the mass production of chipsets (South Bridge, etc.), which are relatively low value-added products. It is meaningful in that it is revealed above. In addition, as it included a long-term development period of more than two years, it is highly likely that the production of other new cooperative products will follow from the second half of the year.
In addition, it should be noted that even though it is not a high-tech product that requires high technology and timeliness such as CPU, the outsourcing of Intel is in charge of the Texas Austin fab, not Samsung Electronics’ Giheung fab, as it is interpreted as a result of reflecting national requirements .
Analyst Kim said, “(Intel’s) new top management recognizes that Intel’s technology and production capacity are’national’ assets, and Intel’s outsourcing production (foundry selection) has a production base in the United States, and security for technology leakage. It is highly likely to be derived as an option that takes into account.
Finally, he pointed out that Intel is highly likely to change from a comprehensive semiconductor company (IDM, in charge of both design and production) to a hybrid outsourcing business model that has long adhered to.
According to him, Intel is expected to pursue’price bargaining power’ and’reduction of uncertainty in yield and productivity after the EUV utilization stage’ by using the competitive relationship between TSMC and Samsung Electronics in Taiwan. Therefore, Samsung Electronics will try to reduce the gap in foundry competitiveness, which was significantly inferior to TSMC, through the ease of geographical development and large-scale allocation of capacity to Intel under the multi-consignment production system. see.
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