KOAsia-Hanatech, Samsung Foundry DSP Alliance Formation

“System semiconductor large order business goal” … to build a pool of 400 people

KoAsia Chairman Lee Hee-joon (right) and Hanatech CEO Lee Jae-man (left) are taking commemorative photos after signing a business agreement (MOU).
KoAsia Chairman Lee Hee-joon (right) and Hanatech CEO Lee Jae-man (left) are taking commemorative photos after signing a business agreement (MOU).

System semiconductor design company CoAsia announced that it will establish a cooperation model for a large system semiconductor order business with a domestic design service company. KOAsia and Hanatech signed a business agreement (MOU) on the 6th.

KoAsia and Hanatech are official design solution partners (DSP) of Samsung Electronics Safe (Samsung Foundry Ecosystem). In addition to Gaon Chips, a Samsung foundry DSP, two domestic fabless companies with advanced engineers also participated in the agreement.

With this agreement, CoAsia and Hanatech plan to establish a cooperative system for global order-taking projects by sharing their technologies, manpower, and infrastructure. After the agreement, the total size of the Allied Forces was about 400. “If we add new engineers for each company scheduled to be hired this year, the manpower pool will increase to the level of 600-700 by the end of the year.” Said.

Currently, the foundry market is facing an era of semiconductor supercycle (super booming) as demand continues to increase. Samsung Electronics has announced that it will invest a total of 133 trillion won in the system semiconductor field by 2030.

An official from KoAsia said, “In line with Samsung Electronics’ Pure Foundry policy, we formed an alliance for large-scale global order-taking projects. We will work closely with the alliance to provide globally competitive system semiconductor design solutions.” He said, “As the semiconductor industry is very booming, the role of DSP that provides optimization solutions to the foundry production process will also grow,” he said. “Through the formation of an alliance, we will grow together and take the lead in strengthening domestic system semiconductor specialized design competitiveness.”

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