[서울=뉴스핌] Reporter Yang-seop Kim = Hana Micron (CEO Dong-cheol Lee), a company specializing in packaging and testing for semiconductor post-processing, announced on the 5th that Hana Double ULS (hereinafter referred to as Hana WLS), which had a physical division in January, plans to expand facilities for full-scale external growth.
Hana WLS is a company established by physically dividing the BUMP and Probe TEST divisions of the parent company Hana Micron. Hana Micron, which achieved business stabilization after the start of bump mass production in 2019, announced that it has decided to expand facilities to strengthen its bump business and respond to increasing customer orders. Hana WLS has domestic and overseas fabless customers including N, the No. 1 global automotive semiconductor company.
According to an official from Hana Micron, at the end of March, through a consortium of Korea Investment Partners and Notic Capital, 25 billion won was raised for facility investment, and additional necessary funds will be raised through internal reserves.
“By attracting this investment, we are planning to achieve top-line growth and expand capacity by at least 30,000 units per month in the mid to long term.” We are looking forward to achieving it,” he added.
The core competitiveness of Hana WLS is the thick RDL technology that implements RDL over 20µm, and the company is the only global company that can develop and mass-produce it. It is applied to the charger IC, and its strength is that it can be charged at a high speed without increasing the size of the semiconductor chip.
In fact, Hana WLS’s Thick RDL technology is applied to the global company N’s Quick Charger IC, which is exclusively supplied to Samsung Electronics’ smartphone flagship models. Company N is the number one global automotive semiconductor company, and is expected to benefit from the growing demand for automotive semiconductors due to the widespread use of autonomous vehicles and electric vehicles in the future.
An official from Hana Micron said, “Hana WLS will provide a differentiated business model compared to competitors of the Full Turnkey method of the post process from bumping to package to final test through linkage with Hana Micron’s packaging service.” “It will be possible to perform all the post-processing of high-end packages such as WLP, Flip chip, SIP, and SOC.”
Lee Dong-cheol, CEO of Hana Micron, said, “The business that has been in the red since the start of mass production of bumping has passed the break-even point at the end of this year, and is expected to grow significantly in terms of profits from next year.” By promoting product diversification such as business expansion and FOWLP technology development, we will increase business efficiency and increase corporate value.”
On the other hand, Hana Micron plans to promote Hana WLS’s public offering by expanding its growth stride after the split-off.
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